Encapsulation parameters - Sichuan Huacan Electronics Co., LTD.

HC-Package-DFN1010

DFN1010 encapsulation parameters

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HC-Package-DFN1216-4

DFN1216-4 Packaging parameters

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HC-Package-SO8

SO8 encapsulation parameters

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HC-Package-SO16

SO16 encapsulation parameters

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HC-Package-SOT23

SOT23 Encapsulation parameters

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HC-Package-SOT89

STO89 Encapsulation parameters

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HC-Package-SOT553

SOT553 Encapsulation parameters

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HC-Package-TO220AB

TO220AB Encapsulation parameters

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HC-Package-TO92S（Type A）

TO92S（Type A） Encapsulation parameters

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HC-Package-TO92S (Type B)

TO92S (Type B) Encapsulation parameters

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HC-Package-TO94

TO94 Encapsulation parameters

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HC-Package-TO251

TO251 Encapsulation parameters

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HC-Package-TO92

TO92 Encapsulation parameters

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HC-Package-TO247-Type-MC

TO247-Type-MC Encapsulation parameters

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HC-Package-TO252-DPAK

TO252-DPAK Encapsulation parameters

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HC-Package-cer01陶瓷封装

Cer01 ceramic package parameters

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Address: 66 Nanhu Road, Deyang Economic and Technological Development Zone, Sichuan Province

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